Oxygen‑Free Copper for High‑Purity Conductive Applications

Aug .12 .2026

Oxygen‑free copper (OFC) contains extremely low oxygen content. This eliminates internal oxide inclusions and delivers maximum electrical and thermal conductivity among commercially available copper materials.


High‑end vacuum components, high‑power cables, vacuum seals and semiconductor heat spreaders often choose oxygen‑free copper. The absence of oxygen prevents hydrogen embrittlement during high‑temperature brazing processes.


Oxygen‑free copper can be easily forged, rolled and drawn. It is soft and ductile, suitable for deep drawing, bending and ultra‑thin foil production.


We provide oxygen‑free copper sheets, rods, tubes and bus bars. Material certificates are available to verify purity levels for customers working in vacuum, energy and semiconductor industries.